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Area Piezoelectric, dielectric and electrostatic devices and associated materials for frequency control, selection and detection / Materials for Surface Acoustic Wave (SAW) devices

IEV ref 561-07-07

en
crack, <material for SAW devices>
fracture that extends to the surface of the wafer and that can or cannot penetrate the entire thickness

fr
fissure, <matériau pour dispositifs OAS> f
fracture qui s’étend jusqu’à la surface de la plaquette et qui peut ou ne peut pas pénétrer toute l’épaisseur

ar
شرخ
صدع

de
Riss, <Wafer> m

es
fractura

it
rottura

ko
균열

ja
クラック

pl
pęknięcie, n

pt
racha

zh
裂纹

Publication date: 2021-08
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