| slope of the perimeter edge of a wafer
Note 1 to entry: The process of forming a slope is called “bevelling”.
Note 2 to entry: Machining of the perimeter edge of a wafer can be performed through bevelling or edge rounding. Whereas bevelling produces a flat slope, edge rounding (as the term implies) produces a rounded edge.
Note 3 to entry: Both bevelling and edge rounding, and their tolerances, are subject to agreement between the user and the supplier.