International
Electrotechnical
Commission
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Area
Micro-electromechanical systems (MEMS)
/ Bonding and assembling technology
IEV ref
523-06-07
en
wafer level packaging
process to complete packaging before dicing the
wafer
[SOURCE: IEC 62047-1:2016, 2.6.10]
fr
encapsulation au niveau de la tranche
, f
procédé prévu pour compléter l’encapsulation avant le découpage en dés de la
tranche
[SOURCE: IEC 62047-1:2016, 2.6.10]
cs
pouzdření na úrovni desky (waferu)
de
Wafer-Level-Packaging, n
ja
ウエハレベルパッケージング
nl
be
verpakking op waferniveau, f
pl
obudowywanie na poziomie płytki, n
umieszczanie obudowy ochronnej na strukturach płytki, n
pt
empacotamento ao nível da bolacha
empacotamento ao nível da
wafer
zh
圆片级封装
Publication date:
2018-12
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