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IEVref:521-03-18ID:
Language:enStatus: Standard
Term: chemical mechanical polishing
Synonym1: CMP
[Preferred]
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Definition: planarization process for a substrate by a combination of mechanical polishing and chemical etching

Note 1 to entry: Chemical mechanical polishing is applied mainly to planarize steps on a substrate due to the semiconductor manufacturing process. Because the steps are composed of a plurality of materials such as substrates, dielectrics and metals, various slurries are used to remove selectively each material. In micro-electromechanical devices, chemical mechanical polishing is used to planarize the bonding surfaces in the wafer level packaging process.

Note 2 to entry: This note applies to the French language only.


Publication date:2018-12
Source:IEC 62047-1:2016, 2.5.8
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