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Area Piezoelectric,dielectric and electrostatic devices and associated materials for frequency control, selection and detection / Materials for Surface Acoustic Wave (SAW) devices

IEV ref561-07-09

en
diameter of wafer
diameter of circular portion of wafer excluding the orientation flat and secondary flat regions

fr
diamètre de la plaquette, m
diamètre de la partie circulaire de la plaquette, à l’exclusion des zones du plan d’orientation et du plan secondaire

ar
قطرالرقاقة

de
Waferdurchmesser, m

es
diámetro de agua

it
diametro della fetta

ko
웨이퍼 직경

ja
ウェハの直径

pl
średnica płytki, f

pt
diâmetro da bolacha

zh
晶片直径

Publication date: 2014-11
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